APPLIED MATERIALS 0010-59787 Ceramic Heater

Description

The AMAT 0010-59787 PECVD reactor is a deposition chamber designed to deposit thin films or layers onto substrates used in various electronic devices and systems. The system employs a Chemical Vapor Deposition (CVD) process to deposit the desired film material onto the surface of the substrate.

Specifications

• Reactor Type: PECVD (Plasma Enhanced Chemical Vapor Deposition)
• Substrate Loading: Automated single loading chamber
• Integrated Modules: Power, vacuum, and gas delivery system
• Deposition Process: Low-pressure, low-temperature CVD (LP-CVD)
• Process Control: Graphic interface with extensive data logging
• Operating Window: Adjustable temperature, pressure, and process parameters
• Process Gas: Supports multiple reactive gases

Features

• Chamber Design:Easy-to-use chamber design enables excellent deposition uniformity and consistent layer thickness across the substrate surface.
• Automation and Integration:The reactor is equipped with an automated loading and unloading chamber, as well as integrated power, vacuum, and gas delivery modules. This design minimizes substrate handling time, ensuring shorter overall processing times.
• High Process Temperature:The chamber can achieve higher process temperatures than traditional thermal CVD processes, enabling the production of higher quality thin films.
• User-Friendly Operation:The system is designed for simple, intuitive operation, featuring an easy-to-navigate graphical interface and a robust system architecture.
• Flexible Processing Parameters:A wide process window allows users to adjust temperature, pressure, and other parameters based on specific deposition needs. This flexibility supports the production of a broad range of high-quality films.
• LP-CVD Process:The reactive gas delivery system utilizes low-pressure, low-temperature CVD to deposit the required thin film material onto the substrate surface. The LP-CVD process allows users to select from multiple reactive gases and adjust gas composition, enabling the creation of highly specialized films.
• Uniform Thin Film Deposition:The chamber design ensures highly uniform film deposition with the potential for precise and repeatable film thickness profiles across the substrate surface.
• Process Control:Equipped with user-friendly controllers, the system offers extensive data recording and process control features, ensuring process safety and consistent, reliable results.