Siemens and GlobalFoundries Strengthen Industrial Automation with AI‑Driven Semiconductor Manufacturing
AI Collaboration Reshapes Semiconductor and Factory Automation
Siemens and GlobalFoundries (GF) formed a strategic partnership to advance semiconductor manufacturing through AI‑enhanced industrial automation. Both companies aim to integrate automation technologies, electrification, and digital engineering tools across the full semiconductor lifecycle. Moreover, they plan to connect chip design, fab automation, and product lifecycle management (PLM) into a unified digital ecosystem that supports modern control systems, PLC‑based workflows, and large‑scale factory automation.
Strengthening Global Supply Chains Through Advanced Control Systems
Cedrik Neike of Siemens emphasized the growing dependence of global industries on silicon technology. He highlighted how robotics, connectivity, and AI rely on stable semiconductor supply chains. Therefore, Siemens and GF intend to reinforce supply chain resilience by enabling more localized and efficient chip production. This approach aligns with current industrial automation trends, where manufacturers seek tighter integration between DCS platforms, MES systems, and semiconductor fabrication tools.
Accelerating Growth with Secure and Reliable Manufacturing Technologies
The collaboration aims to deliver new capabilities that support faster industry growth and improved reliability. In addition, both companies plan to enhance security across semiconductor production, which has become essential as factories adopt more connected control systems. My experience with automation projects shows that semiconductor fabs benefit greatly from unified data models and real‑time monitoring, especially when integrating PLC networks with high‑precision process equipment.
Enabling Next‑Generation Chips for AI and Edge Applications
GF CEO Tim Breen noted that secure, locally produced semiconductors form the foundation of the AI transition. He stressed that AI now moves from cloud environments into physical devices, requiring energy‑efficient and highly connected chips. As a result, the partnership with Siemens will accelerate development of differentiated semiconductor technologies for next‑generation industrial automation, smart sensors, and edge control systems. This direction reflects a broader industry shift toward distributed intelligence within factories.
Application Scenarios and Industry Use Cases
- AI‑Enhanced Fab Automation：Semiconductor fabs can integrate Siemens digital twins with GF process data to optimize wafer handling, reduce cycle time, and improve tool utilization.
- Edge‑Ready Industrial Control Systems：Next‑generation chips from GF may support advanced PLC and DCS applications, enabling faster real‑time processing at the equipment level.
- Secure Local Manufacturing：Localized chip production helps automation companies reduce supply risks and maintain stable production schedules for control systems and factory automation equipment.
- Energy‑Efficient Smart Sensors：The partnership may accelerate development of low‑power sensors for robotics, predictive maintenance, and industrial IoT deployments.
- Integrated Product Lifecycle Management：Manufacturers can streamline design‑to‑production workflows by connecting chip development tools with PLM and MES systems.
