Description
The GE DS200TCQCG1BHF is an Analog I/O Expander Board used in the Mark V Speedtronic turbine control system. It functions as an RST Overflow card, providing additional analog‑signal processing capacity and excitation for LVDT/LVDR position‑feedback devices in heavy‑duty and aero‑derivative gas turbine applications.
Hardware Specifications
| Parameter |
Specification |
| Model |
DS200TCQCG1BHF |
| Brand |
General Electric |
| Series |
Mark V Speedtronic |
| Assembly Type |
Normal Assembly |
| PCB Coating |
Normal Coating |
| Functional Revision 1 |
B |
| Functional Revision 2 |
H |
| Artwork Revision |
F |
| Origin |
United States |
| Weight |
Approx. 2 lbs |
| Dimensions |
Standard Mark V PCB form factor |
| Operating Temp |
–30 to +55 °C (typical Mark V rating) |
| Product Type |
Analog I/O Expander Boards |
Functional Description
The DS200TCQCG1BHF is an Analog I/O Expander Board designed to extend the analog‑signal handling capabilities of the Mark V control system. It is commonly deployed in EX2000‑based turbine control configurations and supports GE’s triple‑redundant R/S/T processor architecture.
The board provides excitation for LVDT and LVDR sensors and includes extensive onboard signal‑conditioning components. It routes overflow analog signals to the controller through multiple vertical pin connectors and header interfaces. Its “BHF” revision sequence indicates two functional revisions (B and H) and an F‑rated artwork revision, enhancing stability and compatibility with later Mark V hardware.
Frequently Asked Questions
Q: Does DS200TCQCG1BHF have irregular product revisions? Yes. The second functional revision “H” is uncommon within the TCQC family but fully supported.
Q: What does “normal coating” mean for this board? It refers to GE’s standard thick protective PCB coating, offering basic moisture and contamination resistance.
Q: Is this board used only in EX2000 systems? It is most commonly used in EX2000 subsets but is compatible with broader Mark V architectures.
Field Installation Guidelines
- Duplicate all jumper positions from the previous board before installation.
- Use ESD‑safe handling procedures at all times.
- Ensure all vertical pin connectors are fully seated.
- Maintain shield continuity on analog wiring to reduce noise.
- Inspect PCB surfaces for contamination or oxidation before mounting.
- Verify correct alignment using the board’s edge markings.
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