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Frequently inquire Together
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InquiryHoneywell 51402455-100 Dual Node Card File (DNCF)
The Honeywell 51402455-100, also cataloged as the 51402455 Dual Node Card File, operates as a dedicated rack chassis for dual‑node Local Control Network (LCN) integration within TDC 3000 systems.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | 51402455-100 |
| Brand | Honeywell |
| Origin | USA |
| Weight | 6.8 kg (15 lbs) |
| Dimensions | 482.6 mm × 609.6 mm × 88.9 mm (19 in × 24 in × 3.5 in) |
| Operating Temp | 0 to 60 deg C |
| Storage Temp | −40 to +85 deg C |
| Humidity | 5% to 95%, non‑condensing |
| Input Voltage | 100–240 VAC (auto‑range) |
| Frequency | 50 / 60 Hz |
| Power Consumption | 50 W maximum |
| Mounting Style | EC Classic front‑rear card cage |
| Node Capacity | Two independent LCN nodes |
| Board Configurations | Supports one 3‑board node and one 2‑board node simultaneously |
| I/O Access | Front logic boards with rear I/O termination |
| Ingress Protection | IP20 |
| Cooling | Integrated forced‑air fan assembly |
4–20 mA HART Loop Protocol & Channel Isolation
Although primarily a chassis infrastructure, the DNCF applies Honeywell’s isolation principles used in 4–20 mA HART loop environments. Each node receives independent power feeds via the dual node power supply (DNPWR), ensuring channel‑to‑channel isolation between LCN modules. This architecture prevents interference between redundant nodes and stabilizes communication across the TDC 3000 system family.
Frequently Asked Questions
Q: Can the DNCF chassis be energized while inserting modules? A: No, modules must be inserted or removed only when the chassis is de‑energized to prevent undefined states.
Q: How many nodes can be hosted simultaneously? A: The chassis supports up to two nodes, one configured with three boards and the other with two boards.
Q: What is the maximum power draw of the chassis? A: The chassis consumes up to 50 W under full load conditions.
Field Installation Guidelines
- Mount the chassis in a standard 19‑inch rack with front‑rear card cage alignment.
- Ensure forced‑air cooling fans are unobstructed to maintain thermal stability.
- Route AC input wiring separately from signal cabling to minimize EMI.
- Verify grounding of chassis and shield connections before energizing.
- Confirm node addressing and board slot allocation prior to installation.
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